{"title":"共 60 伽玛射线辐照对 SiGe HBT 直流和射频特性的影响","authors":"Guofang Yu, Jie Cui, Yue Zhao, Wenpu Cui, Jun Fu","doi":"10.1016/j.microrel.2024.115443","DOIUrl":null,"url":null,"abstract":"<div><p>This study investigates the effects of Co-60 gamma-ray irradiation on the DC and RF characteristics of the SiGe HBTs, with a total dose of up to 4000 krad(Si). The degradation of the forward base current is primarily attributed to surface recombination due to the induced interface traps. The ideality factor of the forward excess base current is affected by the positive oxide-trapped charges at the interface of the emitter-base spacer oxide. TCAD simulation results indicate that the effective integral region of the surface recombination rate is associated with the positive oxide-trapped charge density. The accumulation of positive oxide-trapped charges in the shallow trench isolation oxide has an impact on the potentials of the interface and epi-collector region, subsequently affecting the base diffusion current. Therefore, the ideality factor of the reverse excess base current depends on the device geometry. The RF characterization suggests that the depletion capacitance of the base-emitter junction is more susceptible to gamma-ray irradiation compared to the base-collector junction. And the cut-off frequency experiences a slight degradation as the total dose increases.</p></div>","PeriodicalId":51131,"journal":{"name":"Microelectronics Reliability","volume":"159 ","pages":"Article 115443"},"PeriodicalIF":1.6000,"publicationDate":"2024-06-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Effects of co-60 gamma-ray irradiation on the DC and RF characteristics of SiGe HBTs\",\"authors\":\"Guofang Yu, Jie Cui, Yue Zhao, Wenpu Cui, Jun Fu\",\"doi\":\"10.1016/j.microrel.2024.115443\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><p>This study investigates the effects of Co-60 gamma-ray irradiation on the DC and RF characteristics of the SiGe HBTs, with a total dose of up to 4000 krad(Si). The degradation of the forward base current is primarily attributed to surface recombination due to the induced interface traps. The ideality factor of the forward excess base current is affected by the positive oxide-trapped charges at the interface of the emitter-base spacer oxide. TCAD simulation results indicate that the effective integral region of the surface recombination rate is associated with the positive oxide-trapped charge density. The accumulation of positive oxide-trapped charges in the shallow trench isolation oxide has an impact on the potentials of the interface and epi-collector region, subsequently affecting the base diffusion current. Therefore, the ideality factor of the reverse excess base current depends on the device geometry. The RF characterization suggests that the depletion capacitance of the base-emitter junction is more susceptible to gamma-ray irradiation compared to the base-collector junction. And the cut-off frequency experiences a slight degradation as the total dose increases.</p></div>\",\"PeriodicalId\":51131,\"journal\":{\"name\":\"Microelectronics Reliability\",\"volume\":\"159 \",\"pages\":\"Article 115443\"},\"PeriodicalIF\":1.6000,\"publicationDate\":\"2024-06-17\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Microelectronics Reliability\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://www.sciencedirect.com/science/article/pii/S0026271424001239\",\"RegionNum\":4,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q3\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Microelectronics Reliability","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0026271424001239","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
Effects of co-60 gamma-ray irradiation on the DC and RF characteristics of SiGe HBTs
This study investigates the effects of Co-60 gamma-ray irradiation on the DC and RF characteristics of the SiGe HBTs, with a total dose of up to 4000 krad(Si). The degradation of the forward base current is primarily attributed to surface recombination due to the induced interface traps. The ideality factor of the forward excess base current is affected by the positive oxide-trapped charges at the interface of the emitter-base spacer oxide. TCAD simulation results indicate that the effective integral region of the surface recombination rate is associated with the positive oxide-trapped charge density. The accumulation of positive oxide-trapped charges in the shallow trench isolation oxide has an impact on the potentials of the interface and epi-collector region, subsequently affecting the base diffusion current. Therefore, the ideality factor of the reverse excess base current depends on the device geometry. The RF characterization suggests that the depletion capacitance of the base-emitter junction is more susceptible to gamma-ray irradiation compared to the base-collector junction. And the cut-off frequency experiences a slight degradation as the total dose increases.
期刊介绍:
Microelectronics Reliability, is dedicated to disseminating the latest research results and related information on the reliability of microelectronic devices, circuits and systems, from materials, process and manufacturing, to design, testing and operation. The coverage of the journal includes the following topics: measurement, understanding and analysis; evaluation and prediction; modelling and simulation; methodologies and mitigation. Papers which combine reliability with other important areas of microelectronics engineering, such as design, fabrication, integration, testing, and field operation will also be welcome, and practical papers reporting case studies in the field and specific application domains are particularly encouraged.
Most accepted papers will be published as Research Papers, describing significant advances and completed work. Papers reviewing important developing topics of general interest may be accepted for publication as Review Papers. Urgent communications of a more preliminary nature and short reports on completed practical work of current interest may be considered for publication as Research Notes. All contributions are subject to peer review by leading experts in the field.