{"title":"纳秒电流脉冲范围内 Si RBDT 和 SiC MOSFET 的瞬态导通特性","authors":"Zhengheng Qing, Lin Liang, Tong Liu","doi":"10.1016/j.sse.2024.108953","DOIUrl":null,"url":null,"abstract":"<div><p>With the development of pulse power supplies, solid-state semiconductor switches are required to have fast switching speeds and low losses. Both Reverse blocking diode thyristor (RBDT) and silicon carbide metal oxide semiconductor field effect transistor (SiC MOSFET) have fast turn-on speed, making them suitable candidates for short pulse generator. In this paper, the transient turn-on characteristics of Si RBDT and SiC MOSFET are analyzed theoretically and validated experimentally. Si RBDT and commercial 1.2 kV/81A SiC MOSFET are comparatively investigated in switching current pulse with a rise time of several hundreds of nanoseconds. (1) The anode current of RBDT could rise exponentially because of the latch-up effect of Si RBDT, while the drain current of SiC MOSFET tends to be saturated. (2) Utilizing the current rise time (<em>T</em><sub>rise</sub>) to represent the switching speed, SiC MOSFET can switch faster when the current is lower than 400A. With the increase of the current, Si RBDT presents faster turn-on speed and lower switching loss due to the regenerative action of the two coupled transistors. (3) The transient characteristics of Si RBDT include a voltage-controlled inductance, while SiC MOSFET contains a current-controlled inductance based on the current rise time, respectively. With the increasing of the main voltage, the equivalent inductance of Si RBDT decreases and tends to be saturated when the main voltage is higher than half of the breakdown voltage of Si RBDT. For SiC MOSFET, the equivalent inductance increases until the drain current remains stable for a given gate voltage. This paper confirms the advantages of Si RBDT and SiC MOSFET in different situations.</p></div>","PeriodicalId":21909,"journal":{"name":"Solid-state Electronics","volume":"217 ","pages":"Article 108953"},"PeriodicalIF":1.4000,"publicationDate":"2024-05-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Transient turn-on characteristics of Si RBDT and SiC MOSFET under nanosecond current pulse range\",\"authors\":\"Zhengheng Qing, Lin Liang, Tong Liu\",\"doi\":\"10.1016/j.sse.2024.108953\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><p>With the development of pulse power supplies, solid-state semiconductor switches are required to have fast switching speeds and low losses. Both Reverse blocking diode thyristor (RBDT) and silicon carbide metal oxide semiconductor field effect transistor (SiC MOSFET) have fast turn-on speed, making them suitable candidates for short pulse generator. In this paper, the transient turn-on characteristics of Si RBDT and SiC MOSFET are analyzed theoretically and validated experimentally. Si RBDT and commercial 1.2 kV/81A SiC MOSFET are comparatively investigated in switching current pulse with a rise time of several hundreds of nanoseconds. (1) The anode current of RBDT could rise exponentially because of the latch-up effect of Si RBDT, while the drain current of SiC MOSFET tends to be saturated. (2) Utilizing the current rise time (<em>T</em><sub>rise</sub>) to represent the switching speed, SiC MOSFET can switch faster when the current is lower than 400A. With the increase of the current, Si RBDT presents faster turn-on speed and lower switching loss due to the regenerative action of the two coupled transistors. (3) The transient characteristics of Si RBDT include a voltage-controlled inductance, while SiC MOSFET contains a current-controlled inductance based on the current rise time, respectively. With the increasing of the main voltage, the equivalent inductance of Si RBDT decreases and tends to be saturated when the main voltage is higher than half of the breakdown voltage of Si RBDT. For SiC MOSFET, the equivalent inductance increases until the drain current remains stable for a given gate voltage. This paper confirms the advantages of Si RBDT and SiC MOSFET in different situations.</p></div>\",\"PeriodicalId\":21909,\"journal\":{\"name\":\"Solid-state Electronics\",\"volume\":\"217 \",\"pages\":\"Article 108953\"},\"PeriodicalIF\":1.4000,\"publicationDate\":\"2024-05-10\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Solid-state Electronics\",\"FirstCategoryId\":\"101\",\"ListUrlMain\":\"https://www.sciencedirect.com/science/article/pii/S0038110124001023\",\"RegionNum\":4,\"RegionCategory\":\"物理与天体物理\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q3\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Solid-state Electronics","FirstCategoryId":"101","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0038110124001023","RegionNum":4,"RegionCategory":"物理与天体物理","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
摘要
随着脉冲电源的发展,要求固态半导体开关具有快速开关速度和低损耗。反向阻断二极管晶闸管(RBDT)和碳化硅金属氧化物半导体场效应晶体管(SiC MOSFET)都具有快速导通速度,因此适合用于短脉冲发生器。本文对 Si RBDT 和 SiC MOSFET 的瞬态导通特性进行了理论分析和实验验证。比较研究了 Si RBDT 和商用 1.2 kV/81A SiC MOSFET 在上升时间为几百纳秒的开关电流脉冲中的特性。(1) 由于 Si RBDT 的闩锁效应,RBDT 的阳极电流可呈指数上升,而 SiC MOSFET 的漏极电流趋于饱和。(2)利用电流上升时间(Trise)来表示开关速度,当电流小于 400A 时,SiC MOSFET 的开关速度更快。随着电流的增加,由于两个耦合晶体管的再生作用,Si RBDT 的导通速度更快,开关损耗更低。(3) Si RBDT 的瞬态特性包含电压控制电感,而 SiC MOSFET 则包含基于电流上升时间的电流控制电感。随着主电压的升高,Si RBDT 的等效电感降低,当主电压高于 Si RBDT 击穿电压的一半时,等效电感趋于饱和。对于 SiC MOSFET,等效电感会增加,直到漏极电流在给定栅极电压下保持稳定。本文证实了 Si RBDT 和 SiC MOSFET 在不同情况下的优势。
Transient turn-on characteristics of Si RBDT and SiC MOSFET under nanosecond current pulse range
With the development of pulse power supplies, solid-state semiconductor switches are required to have fast switching speeds and low losses. Both Reverse blocking diode thyristor (RBDT) and silicon carbide metal oxide semiconductor field effect transistor (SiC MOSFET) have fast turn-on speed, making them suitable candidates for short pulse generator. In this paper, the transient turn-on characteristics of Si RBDT and SiC MOSFET are analyzed theoretically and validated experimentally. Si RBDT and commercial 1.2 kV/81A SiC MOSFET are comparatively investigated in switching current pulse with a rise time of several hundreds of nanoseconds. (1) The anode current of RBDT could rise exponentially because of the latch-up effect of Si RBDT, while the drain current of SiC MOSFET tends to be saturated. (2) Utilizing the current rise time (Trise) to represent the switching speed, SiC MOSFET can switch faster when the current is lower than 400A. With the increase of the current, Si RBDT presents faster turn-on speed and lower switching loss due to the regenerative action of the two coupled transistors. (3) The transient characteristics of Si RBDT include a voltage-controlled inductance, while SiC MOSFET contains a current-controlled inductance based on the current rise time, respectively. With the increasing of the main voltage, the equivalent inductance of Si RBDT decreases and tends to be saturated when the main voltage is higher than half of the breakdown voltage of Si RBDT. For SiC MOSFET, the equivalent inductance increases until the drain current remains stable for a given gate voltage. This paper confirms the advantages of Si RBDT and SiC MOSFET in different situations.
期刊介绍:
It is the aim of this journal to bring together in one publication outstanding papers reporting new and original work in the following areas: (1) applications of solid-state physics and technology to electronics and optoelectronics, including theory and device design; (2) optical, electrical, morphological characterization techniques and parameter extraction of devices; (3) fabrication of semiconductor devices, and also device-related materials growth, measurement and evaluation; (4) the physics and modeling of submicron and nanoscale microelectronic and optoelectronic devices, including processing, measurement, and performance evaluation; (5) applications of numerical methods to the modeling and simulation of solid-state devices and processes; and (6) nanoscale electronic and optoelectronic devices, photovoltaics, sensors, and MEMS based on semiconductor and alternative electronic materials; (7) synthesis and electrooptical properties of materials for novel devices.