Lei Yue, Qing Xu, Hao Wang, Mudassar Rauf, Jabir Mumtaz
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Simulation-based optimisation for order release of printed circuit board workshop with process switching constraints
Workload control (WLC) is usually employed to make order release to attain workload balance, satisfactory delivery rate and high production efficiency. However, in the real production environment of printed circuit board (PCB) industries, slight modifications in the product process shifts the bottleneck resources which leads to misjudge the effect of WLC and may ultimately increase the lateness of orders. Therefore, this research focuses on the order release problem of PCB production system considering main process flow and shifting of bottlenecks. At first, certain improvements are proposed on the classic WLC method and two order release control strategies based on process switching are designed to generate order release plan on the basis of Lancaster University Management School Corrected Order Release method. Furthermore, different scheduling rules are investigated along with the upper workload limits on the PCB system simultaneously. Finally, a simulation model is developed to analyse the impact of order release methods on the system performance through simulation experiments. Furthermore, extensive simulation experiments for different scheduling rules on bottleneck resource and different workload upper limit ratios are also carried out in the current research. Simulation results show that the process order release control strategy based on process switching has a strong adaptability in PCB manufacturing system.
期刊介绍:
IET Collaborative Intelligent Manufacturing is a Gold Open Access journal that focuses on the development of efficient and adaptive production and distribution systems. It aims to meet the ever-changing market demands by publishing original research on methodologies and techniques for the application of intelligence, data science, and emerging information and communication technologies in various aspects of manufacturing, such as design, modeling, simulation, planning, and optimization of products, processes, production, and assembly.
The journal is indexed in COMPENDEX (Elsevier), Directory of Open Access Journals (DOAJ), Emerging Sources Citation Index (Clarivate Analytics), INSPEC (IET), SCOPUS (Elsevier) and Web of Science (Clarivate Analytics).