利用国际半导体设备与材料协会（SEMI）设备通信标准传感器开发焊线监测系统

{"title":"利用国际半导体设备与材料协会（SEMI）设备通信标准传感器开发焊线监测系统","authors":"Ying-Chieh Liu, Feng-Chia Li","doi":"10.18494/sam4643","DOIUrl":null,"url":null,"abstract":"","PeriodicalId":22154,"journal":{"name":"Sensors and Materials","volume":"4 2","pages":""},"PeriodicalIF":1.0000,"publicationDate":"2023-11-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Developing a Monitoring System for Wire Bonders Using Semiconductor Equipment and Materials International (SEMI) Equipment Communications Standard Sensors\",\"authors\":\"Ying-Chieh Liu, Feng-Chia Li\",\"doi\":\"10.18494/sam4643\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"\",\"PeriodicalId\":22154,\"journal\":{\"name\":\"Sensors and Materials\",\"volume\":\"4 2\",\"pages\":\"\"},\"PeriodicalIF\":1.0000,\"publicationDate\":\"2023-11-17\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Sensors and Materials\",\"FirstCategoryId\":\"88\",\"ListUrlMain\":\"https://doi.org/10.18494/sam4643\",\"RegionNum\":4,\"RegionCategory\":\"材料科学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q4\",\"JCRName\":\"INSTRUMENTS & INSTRUMENTATION\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Sensors and Materials","FirstCategoryId":"88","ListUrlMain":"https://doi.org/10.18494/sam4643","RegionNum":4,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q4","JCRName":"INSTRUMENTS & INSTRUMENTATION","Score":null,"Total":0}