使用高密度浆料的新型局部电镀方法与传统电解溶液的比较研究:铁样品铜镀层厚度和耐腐蚀性检验

Firas Alhachami
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引用次数: 0

摘要

本文研究了一种新的电镀方法,用高密度浆料代替传统的电解溶液。该方法在涂有铜的铁样品上进行了测试。用leoi-44实验椭偏仪测量了铜层厚度,膏体法处理的铜层厚度为318 nm,传统处理的铜层厚度为400 nm。还测试了样品的耐腐蚀性,两种方法的结果相似。本文的结论是,这种新方法可以用于处理大型或固定金属物体的特定区域,如坦克或管道,以及金属介绍的艺术装饰。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Comparative Study on A Novel Local Electroplating Method Using High-Density Paste Versus Traditional Electrolytic Solutions: An Examination of Copper Coating Thickness and Corrosion Resistance on Iron Samples
This paper presents a study on a new method of electroplating, using a high-density paste instead of traditional electrolytic solutions. The method was tested on iron samples, which were coated with copper. The thickness of the copper layer was measured using a leoi-44 experimental ellipsometer, revealing a thickness of 318 nm for the sample treated with the paste method, and 400 nm for the sample treated traditionally. The corrosion resistance of the samples was also tested, showing similar results for both methods. The paper concludes that this new method could be useful for treating specific areas of large or fixed metal objects, such as tanks or pipelines, and for artistic decoration on metals introduction.
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