使用光子线键的低温光学封装

IF 5.4 1区 物理与天体物理 Q1 OPTICS
APL Photonics Pub Date : 2023-12-12 DOI:10.1063/5.0170974
Becky Lin, Donald Witt, Jeff F. Young, Lukas Chrostowski
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引用次数: 0

摘要

要广泛应用依赖光控量子信息的系统,就必须在低温条件下实现可靠、高效的多通道光纤到芯片连接。在此,我们利用聚合物光子线键(PWB)演示了单模光纤阵列与锥形硅波导之间低至 5 K 的低损耗(每通道 2 dB)连接。介绍了一种组装硅芯片和光纤阵列的方法,使 PWB 连接能够承受温度循环和低温恒温器的烘烤。PWB 的阈值功率处理能力大于 4 dBm,足以证明在 5 K 下与波导耦合的硅微振谐振器的光学双稳态性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Cryogenic optical packaging using photonic wire bonds
The widespread adaptation of systems relying on optically controlled quantum information will require reliable and efficient multi-channel fiber-to-chip connections that function at cryogenic temperatures. Here we demonstrate low loss (2 dB per channel) connections between a single mode fiber array and tapered silicon waveguides down to 5 K using polymer based photonic wire bonds (PWBs). A method is described for assembling the silicon chip and fiber array such that the PWB connections are robust to temperature cycling and cryostat bakeout. The threshold power handling capability of the PWBs is greater than 4 dBm, sufficient to demonstrate optical bistability in silicon microring resonators coupled to the waveguides at 5 K.
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来源期刊
APL Photonics
APL Photonics Physics and Astronomy-Atomic and Molecular Physics, and Optics
CiteScore
10.30
自引率
3.60%
发文量
107
审稿时长
19 weeks
期刊介绍: APL Photonics is the new dedicated home for open access multidisciplinary research from and for the photonics community. The journal publishes fundamental and applied results that significantly advance the knowledge in photonics across physics, chemistry, biology and materials science.
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