半导体激光加工的微观宏观模拟

Tomohito OTOBE
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引用次数: 0

摘要

介绍了飞多(10-15)秒脉冲激光加工半导体和金属,特别是硅和铝的模拟研究的最新进展。激光加工是一个涉及非线性现象的复杂过程。我们已经开发了描述光电子相互作用的微观第一性原理计算,也可以包括金属弛豫的半经典弗拉索夫方程,以及允许我们研究整个初始处理过程的新型温度模型。每种方法都允许我们分析从激光照射到能量转移到晶格阶段的整个过程。本文描述了方法的细节和从结果中得到的发现。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Micro-Macro Simulation for Laser Processing of Semiconductor
Recent developments in the simulations of processing of semiconductors and metals by femto- (10-15) second pulse laser, especially silicon and aluminum, are presented. Laser processing is a complex process involving nonlinear phenomena. We have developed microscopic first-principles calculations that describe the light-electron interaction, the semiclassical Vlasov equation that can also include relaxation in metal, and a novel temperature model that allows us to study the entire initial processing process. Each method allows us to analyze the entire process from the moment of laser irradiation to the stage of energy transfer to the lattice. This paper describes the details of the methods and the findings obtained from the results.
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