Ti-Cr-Al-Nb和Ti-Cr-Al-Nb- v多组分合金的组织和力学性能

IF 0.5 Q4 PHYSICS, NUCLEAR
O.M. Velikodnyi, R.V. Vasilenko, O.S. Kalchenko, I.V. Kolodyi, Y.O. Krainiuk, A.V. Levenets, P.I. Stoev, M.A. Tikhonovsky, G.D. Tolstolutska
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引用次数: 0

摘要

采用经验和半经验模型分析了Ti-Cr-Al-Nb-V系五组分和四组分合金的相结构状态。采用Ti60Cr11Al7Nb11V11和Ti60Cr11Al7Nb22 (at)两种轻质合金组合进行实验研究。%)。采用氩弧熔炼法制备合金锭,在不同温度下进行均匀化、轧制变形和退火处理。实验研究了退火温度对合金的相组织状态、硬度和拉伸力学性能的影响。结果表明,在700 ~ 900℃退火过程中,相组成和晶粒尺寸的变化对合金的硬度和抗拉强度几乎没有影响。900℃退火使合金转变为具有bcc晶格的单相态,显著提高了合金的断裂伸长率,两种合金的断裂伸长率均在30%左右。此外,五组分合金的屈服强度和抗拉强度明显高于四组分合金。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
STRUCTURE AND MECHANICAL PROPERTIES OF Ti-Cr-Al-Nb AND Ti-Cr-Al-Nb-V MULTICOMPONENT ALLOYS
The empirical and semi-empirical models were used to analyze the phase-structural state of five- and fourcomponent alloys of the Ti-Cr-Al-Nb-V system. Two compositions of lightweight alloys were selected for experimental study: Ti60Cr11Al7Nb11V11 and Ti60Cr11Al7Nb22 (at. %). Ingots of these alloys were obtained by argonarc melting method, and they were subjected to homogenization, deformation by rolling and subsequent annealing at different temperatures. The influence of annealing temperature on the phase-structural state of the alloys, their hardness, and mechanical properties during tensile tests has been studied experimentally. It was found that the change of phase composition and grain size during annealing in the temperature range of 700…900 ºC practically does not affect the hardness and tensile strength of alloys. Annealing at 900 ºC transforms the alloys into a singlephase state with bcc lattice and significantly increases the elongation to fracture, which is about 30% for both alloys. In addition, the yield strength and tensile strength of the five-component alloy are noticeably higher than those of the four-component alloy.
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来源期刊
CiteScore
0.70
自引率
50.00%
发文量
0
审稿时长
2-4 weeks
期刊介绍: The journal covers the following topics: Physics of Radiation Effects and Radiation Materials Science; Nuclear Physics Investigations; Plasma Physics; Vacuum, Pure Materials and Superconductors; Plasma Electronics and New Methods of Acceleration.
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