The bond shear test: an application for the reduction of common causes of gold ball bond process variation

Examples indicate that the bond shear test can be used effectively to reduce common cause variability in the wire bond process, allowing in-process monitors to detect unusual events in the process more efficiently. The first example illustrates that before a process can be improved, its measurement system must have less variability than the process it measures. The second example, an investigation of capillary change effects, illustrates that the sensitivity of bond shear can be used to identify bonder components that contribute significantly to process variability. The third example suggests that shear results can be used as a standard whereby a given bonder's power and force parameters can be set to produce consistent bond strengths over time, and many bonders can be set to produce bonds of similar strengths.<>