接触点的电流诱发老化

M. Runde, E. Hodne, B. Tøtdal
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引用次数: 31

摘要

最近对携带直流电的铝接触界面的实验工作表明,电流本身可能是导致接触点退化的原因。扫描电子显微镜对微小导电区内的冶金研究支持了这一结论。高电流密度和接触区的高温引起了电迁移的质量传递。这种质量通过界面的流动是一个非平稳过程,导致空位聚集成团,形成空洞和空腔,电导率逐渐降低。最终,接触点严重退化,无法通过高电流密度,在原接触点附近产生新的电流路径。这可以被认为是一种内在的衰老机制。与所有其他退化过程相反,电流本身,即电子流,被发现直接损害接触点的电学特性
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Current-induced aging of contact spots
Recent experimental work on aluminium contact interfaces carrying direct current suggests that the electric current itself can be responsible for degradation of the contact spots. Scanning electron microscopy studies of the metallurgy inside the minute conducting areas support this conclusion. The high current densities and the high temperature in the contact zones cause a mass transport by electromigration. This mass flow through the interface is a nonstationary process, leading to an accumulation of vacancies cluster and form voids and cavities, and the electrical conductivity is gradually reduced. Eventually, the contact spot is so heavily degraded that it is unable to pass the high current densities, and new current paths are created in the vicinity of the original spot. This can be considered as an intrinsic aging mechanism. In contrast to all other degradation processes, the current itself, i.e. the flow of electrons, is found to impair the electrical properties of the contact spot directly.<>
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