MCP芯片载体的生产

40th Conference Proceedings on Electronic Components and Technology Pub Date : 1990-05-20 DOI:10.1109/ECTC.1990.122222

M. E. Williams

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引用次数: 5

摘要

大规模生产金属化陶瓷聚酰亚胺(MCP)芯片载体已经由IBM实践了好几年。MCP封装包括两层电路，除了通过聚酰亚胺介电层的过孔外，它们是电隔离的。这种电路/聚酰亚胺/电路夹层是通过几道光刻加工在氧化铝陶瓷基座上形成的。与卡的连接由穿过陶瓷封装并进入卡的引脚提供，与芯片的连接由控制芯片连接(C4)焊点提供。介绍了该产品的结构、性能优势和未来的改进。

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Production of MCP chip carriers

Full-scale production of metallized ceramic polyimide (MCP) chip carriers has been practiced for several years by IBM. The MCP package includes two layers of circuitry that are electrically isolated except for vias through a polyimide dielectric layer. This circuitry/polyimide/circuitry sandwich is formed on top of an alumina ceramic base by several passes of photolithographic processing. Connection to the card is provided by pins that go through the ceramic package and into the card, and connection to the chip is provided by controlled collapse chip connection (C4) solder joints. The product construction, performance advantages, and future modifications are described.<>

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来源期刊

40th Conference Proceedings on Electronic Components and Technology

CiteScore

3.10

自引率

0.00%

发文量