揭示地址转换缓存数组中的困难bug,以实现有效的后硅验证

G. Papadimitriou, D. Gizopoulos, Athanasios Chatzidimitriou, Tom Kolan, A. Koyfman, Ronny Morad, V. Sokhin
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引用次数: 3

摘要

硅后验证是微处理器原型芯片生命周期中最重要的部分之一。这是调试工程师在芯片发布到市场之前检测未通过硅前验证的缺陷和错误的最后机会。需要有效的解决方案来利用硬件原型的峰值性能,并评估微处理器芯片是否完全符合指令集和其他规范。我们对最先进的微架构进行了全面的实验研究,以评估和识别地址转换缓存数组(多级tlb和MMU缓存)中最困难的bug,并解释为什么这些bug会跨代持续存在。我们还将它们分为不同的bug场景。然后,我们提出了一种新的方法来生成随机自检刺激程序,该程序可以暴露和检测这些错误场景。实验结果表明,该方法可以检测到传统的后硅验证技术可能忽略的困难错误。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Unveiling difficult bugs in address translation caching arrays for effective post-silicon validation
Post-silicon validation is one of the most important parts of the microprocessor prototype chip lifecycle. It is the last chance for debug engineers to detect defects and bugs that escaped pre-silicon verification, before the chip is released to the market. Effective solutions are required to harness the peak performance of the hardware prototype and evaluate whether the microprocessor chip is fully compliant with the instruction set and other specifications. We perform a comprehensive experimental study on a state-of-the-art microarchitecture to assess and identify the most difficult bugs in address translation caching arrays (multi-level TLBs and MMU Caches), and explain why these bugs persist across generations. We also categorize them into distinct bug scenarios. We then propose a novel methodology for generating random self-checking stimuli programs, which expose and detect such bug scenarios. Our experimental results show that the proposed method can detect difficult bugs that are likely to be missed by traditional post-silicon validation techniques.
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