使用GMI结构封装保护的系统

2021 Smart Systems Integration (SSI) Pub Date : 2021-04-27 DOI:10.1109/SSI52265.2021.9466969

S. Borel, Thibaut Sohier, J. Michel, R. Hida, E. Deschaseaux, J. Souriau, A. Tria, G. Simon

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引用次数: 0

摘要

研究了NiFe/Al/NiFe线的磁阻抗，以形成对物理攻击的保护。他们的行为，当暴露于磁场产生的直流电流流过他们，以及他们的灵敏度微小的修改几何报告。它们在系统封装中的集成是一个机会，可以共同保护多个易受攻击的组件，从而创建一个安全的系统。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Systems Secured by Packaging using a GMI Structure

The magneto-impedance of NiFe/Al/NiFe lines intended to form a protection against physical attacks was studied. Their behavior when exposed to the magnetic field generated by a DC current flowing through them, as well as their sensitivity to tiny modifications of their geometry are reported. Their integration inside the packaging of a system is presented as an opportunity to protect multiple vulnerable dies collectively to make a secure system.

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2021 Smart Systems Integration (SSI)

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