通过独立的2D/3D材料实现混合维度可堆叠电子器件

Jeehwan Kim
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摘要

基于二维材料的器件因其易于堆叠以获得多功能而受到广泛关注。由于它们的超薄厚度,这种多功能设备变得如此灵活和保形,以至于它们可以放置在任何3D特征表面上。然而,由于缺乏在晶圆尺度上逐层堆叠2D材料的策略,2D异质结构通常表现为堆叠的薄片,其中可以制造单个或几个器件。在这次演讲中,我将讨论我们独特的策略,通过使用层分辨分裂(LRS)技术将晶圆级2D材料分离成单层并将其堆叠成异质结构[1]。这项技术使我在麻省理工学院的团队能够探索前所未有的晶圆级2D异质器件,包括集成光子学,3D神经形态计算和微型led,这些将在我的演讲中介绍。虽然2D异质结构有望成为有趣的未来器件,但基于2D材料的器件的性能远远不如传统的3D半导体材料。然而,三维材料以块状形式存在,因此将它们堆叠在一起形成异质结构具有挑战性。显然,这种单晶体在三维特征上的适形涂层是不可能的。我在麻省理工学院的团队最近发明了一种基于二维材料的层转移(2DLT)技术,可以用任何具有优异半导体性能的复合材料生产单晶独立膜[2-4]。该技术是基于石墨烯上的单晶薄膜的远程外延,然后从石墨烯上剥离。独立的三维材料膜的堆叠将使前所未有的三维异质结构成为可能,其性能有望优于二维异质结构。我将谈谈我们团队在将单晶独立膜应用于柔性、共形电子器件以及3D异质结构方面所做的努力。最后,我将通过讨论可以通过我们的LRS和2DLT技术实现的2D-3D混合异质结构器件耦合2D-3D独立膜的观点来结束我的演讲[5,6]。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Mixed-dimensional stackable electronics enabled by freestanding 2D/3D materials
2D material-based devices have received great deal of attention as they can be easily stacked to obtain multifunctionality. With their ultrathin thicknesses, such multifunctioning devices become so flexible and conformal that they can be placed onto any 3D featured surfaces. However, 2D heterostructures are typically demonstrated as stacked flakes where single or few devices can be fabricated due to lack of strategies for layer-by-layer stacking of 2D materials at the wafer scale. In this talk, I will discuss about our unique strategy to isolate wafer-scale 2D materials into monolayers and stack them into a heterostructures by using a layer-resolved splitting (LRS) technique [1]. This technique enables my group at MIT to explore unprecedented wafer-scale 2D heterodevices including integrated photonics, 3D neuromorphic computing, and microLEDs, which will be introduced in my talk. While 2D heterostructures promise interesting futuristic devices, the performance of 2D material-based devices is substantially inferior to that of conventional 3D semiconductor materials. However, 3D materials exist as their bulk form, thus it is challenging to stack them together for heterostructures. Obviously, conformal coating of such single-crystalline bulks on 3D features is impossible. My group at MIT has recently invented a 2D materials-based layer transfer (2DLT) technique that can produce single-crystalline freestanding membranes from any compound materials with their excellent semiconducting performance [2-4]. This technique is based on remote epitaxy of single-crystalline films on graphene followed by peeling from graphene. Stacking of freestanding 3D material membranes will enable unprecedented 3D heterostructures whose performance is expected to be superior to that of 2D heterostructures. I will talk about our group’s effort to apply single-crystalline freestanding membranes for flexible, conformal electronics as well as for 3D heterostructures. Finally, I will conclude my talk by discussing perspectives of coupling 2D-3D freestanding membranes for 2D-3D mixed heterostructured devices that can be enabled by our LRS and 2DLT techniques [5,6].
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