Meng-Fan Chang, Che-Wei Wu, Chia-Chen Kuo, S. Shen, Ku-Feng Lin, Shu-Meng Yang, Y. King, Chorng-Jung Lin, Y. Chih
{"title":"采用45ns随机读取时间的低压电流模式传感方案,在65nm CMOS中实现0.5V 4Mb逻辑过程兼容的嵌入式电阻式RAM (ReRAM)","authors":"Meng-Fan Chang, Che-Wei Wu, Chia-Chen Kuo, S. Shen, Ku-Feng Lin, Shu-Meng Yang, Y. King, Chorng-Jung Lin, Y. Chih","doi":"10.1109/ISSCC.2012.6177079","DOIUrl":null,"url":null,"abstract":"Numerous low-supply-voltage (VDD) mobile chips, such as energy-harvesting-powered devices and biomedical applications, require low-VDD on-chip nonvolatile memory (NVM) for low-power active-mode access and power-off data storage. However, conventional NVMs cannot achieve low-VDD operation due to insufficient write voltage generated by charge-pumped (CP) circuits at a low VDD, and a lack of low-VDD current-mode sense amplifiers (CSA) [1-4] to overcome read issues in reduced sensing margins, degraded speeds, and insufficient voltage headroom (VHR). Resistive RAM (ReRAM) [4-6] is a promising memory with the advantages of short write time, low write-voltage, and reduced write power compared to Flash and other NVMs. Using a low-VDD CP with relaxed output voltage/current requirements for write operations, ReRAM is a good candidate for on-chip low-VDD NVM if a low-VDD CSA is provided, particularly for frequent-read-seldom-write applications. We develop a body-drain-driven CSA (BDD-CSA) with dynamic BL bias voltage (VBL) and small VHR for larger sensing margins to achieve a lower VDDmin, faster read speed, and better tolerance of read cell current (ICELL) and BL leakage current (IBL-LEAK) variations compared to conventional CSAs. A fabricated 65nm 4Mb ReRAM macro using the BDD-CSA and our CMOS-logic-compatible ReRAM cell [7] achieves 0.5V VDDmin. The BDD-CSA achieves 0.32V VDDmin.","PeriodicalId":255282,"journal":{"name":"2012 IEEE International Solid-State Circuits Conference","volume":"11 7","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2012-04-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"71","resultStr":"{\"title\":\"A 0.5V 4Mb logic-process compatible embedded resistive RAM (ReRAM) in 65nm CMOS using low-voltage current-mode sensing scheme with 45ns random read time\",\"authors\":\"Meng-Fan Chang, Che-Wei Wu, Chia-Chen Kuo, S. Shen, Ku-Feng Lin, Shu-Meng Yang, Y. King, Chorng-Jung Lin, Y. Chih\",\"doi\":\"10.1109/ISSCC.2012.6177079\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Numerous low-supply-voltage (VDD) mobile chips, such as energy-harvesting-powered devices and biomedical applications, require low-VDD on-chip nonvolatile memory (NVM) for low-power active-mode access and power-off data storage. However, conventional NVMs cannot achieve low-VDD operation due to insufficient write voltage generated by charge-pumped (CP) circuits at a low VDD, and a lack of low-VDD current-mode sense amplifiers (CSA) [1-4] to overcome read issues in reduced sensing margins, degraded speeds, and insufficient voltage headroom (VHR). Resistive RAM (ReRAM) [4-6] is a promising memory with the advantages of short write time, low write-voltage, and reduced write power compared to Flash and other NVMs. Using a low-VDD CP with relaxed output voltage/current requirements for write operations, ReRAM is a good candidate for on-chip low-VDD NVM if a low-VDD CSA is provided, particularly for frequent-read-seldom-write applications. We develop a body-drain-driven CSA (BDD-CSA) with dynamic BL bias voltage (VBL) and small VHR for larger sensing margins to achieve a lower VDDmin, faster read speed, and better tolerance of read cell current (ICELL) and BL leakage current (IBL-LEAK) variations compared to conventional CSAs. A fabricated 65nm 4Mb ReRAM macro using the BDD-CSA and our CMOS-logic-compatible ReRAM cell [7] achieves 0.5V VDDmin. The BDD-CSA achieves 0.32V VDDmin.\",\"PeriodicalId\":255282,\"journal\":{\"name\":\"2012 IEEE International Solid-State Circuits Conference\",\"volume\":\"11 7\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2012-04-03\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"71\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2012 IEEE International Solid-State Circuits Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISSCC.2012.6177079\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2012 IEEE International Solid-State Circuits Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISSCC.2012.6177079","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A 0.5V 4Mb logic-process compatible embedded resistive RAM (ReRAM) in 65nm CMOS using low-voltage current-mode sensing scheme with 45ns random read time
Numerous low-supply-voltage (VDD) mobile chips, such as energy-harvesting-powered devices and biomedical applications, require low-VDD on-chip nonvolatile memory (NVM) for low-power active-mode access and power-off data storage. However, conventional NVMs cannot achieve low-VDD operation due to insufficient write voltage generated by charge-pumped (CP) circuits at a low VDD, and a lack of low-VDD current-mode sense amplifiers (CSA) [1-4] to overcome read issues in reduced sensing margins, degraded speeds, and insufficient voltage headroom (VHR). Resistive RAM (ReRAM) [4-6] is a promising memory with the advantages of short write time, low write-voltage, and reduced write power compared to Flash and other NVMs. Using a low-VDD CP with relaxed output voltage/current requirements for write operations, ReRAM is a good candidate for on-chip low-VDD NVM if a low-VDD CSA is provided, particularly for frequent-read-seldom-write applications. We develop a body-drain-driven CSA (BDD-CSA) with dynamic BL bias voltage (VBL) and small VHR for larger sensing margins to achieve a lower VDDmin, faster read speed, and better tolerance of read cell current (ICELL) and BL leakage current (IBL-LEAK) variations compared to conventional CSAs. A fabricated 65nm 4Mb ReRAM macro using the BDD-CSA and our CMOS-logic-compatible ReRAM cell [7] achieves 0.5V VDDmin. The BDD-CSA achieves 0.32V VDDmin.