高频接地连接的接触光洁度考虑因素

R. Martens, Suvrat Bhargava, John Consoli, Chad Morgan, Daniel Hubbard
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引用次数: 1

摘要

基础文献和电磁模拟表明,在几欧姆的接地连接上,直流接触电阻值可以容忍,对信号传输的影响很小。这表明,对于高速接地触点,传统的以毫欧姆为数量级的直流触点电阻失效标准可能过于保守,因此可以考虑成本较低的电镀触点。连接器级的电磁模拟验证了信号完整性完好无损,接地接触电阻值高达1欧姆甚至更高。金和非贵金属锡镍合金表现出更高的,但稳定的电接触电阻,与典型的接触表面相比,使用工业标准加速测试进行评估。结果表明,在放宽直流接触电阻失效标准的情况下,成本较低的地面锡镍合金涂层可以在典型高速连接器产品的使用寿命内提供可靠的信号完整性性能。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Contact Finish Considerations for High-Frequency Ground Connections
Fundamental literature and electromagnetic simulations show DC contact resistance values on ground connections of up to several ohms can be tolerated with little impact on signal transmission. This indicates traditional DC contact resistance failure criterion on the order of milliohms may be overly conservative for high-speed ground contacts, enabling consideration of lower cost electroplated contact finishes. Electromagnetic simulations at the connector level validated that signal integrity is intact with ground contact resistance values up to 1 ohm and beyond. Gold and a non-noble tin-nickel alloy exhibiting higher, yet stable electrical contact resistance as compared to typical contact finishes were evaluated using industry standard accelerated testing. Results indicate that with a relaxed DC contact resistance failure criterion, the lower cost ground tin-nickel alloy finish can deliver reliable signal integrity performance over the lifetime of a typical high-speed connector product.
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