硅光子器件及其集成

K. Ohashi
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引用次数: 0

摘要

当引进光通信的成本低于传统电子学时,它就被认为是实用的。硅光子学是低成本高集成光子器件的主要候选材料,因为硅半导体工业提供了当今最具成本效益和高度集成的器件。除此之外,硅作为一种光学材料提供了高折射率对比度波导,因此它提供了微米尺度的无源光学器件。这些优势可能使硅光子学成为芯片网络等较短互连以及长途电信设备的关键技术。本文将简要讨论利用三维集成和表面等离子体器件实现光子与大规模集成电路的低成本集成。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Silicon photonic devices and their integration
Optical communication is accepted as practical when the cost of introducing it is less than that of the conventional electronics. Silicon photonics is the prime candidates for low-cost highly integrated photonic devices because silicon semiconductor industry gives the most cost-effective and highly-integrated devices today. In addition to that, silicon as an optical material offers high-index contrast waveguides and hence it gives micro-meter scale passive optical devices. Those advantages could lead silicon photonics as a key technology for shorter interconnects such as on-chip networks as well as for long-haul telecommunication devices. Low cost integration of photonics with LSI using 3D-integration and surface-plasmon devices will be discussed briefly.
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