基于偏置温度不稳定性和热载流子注入的SRAM稳定性分析

Taizhi Liu, Chang-Chih Chen, Jiadong Wu, L. Milor
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引用次数: 25

摘要

偏置温度不稳定性(BTI)和热载流子注入(HCI)是增加晶体管阈值电压并进一步导致性能下降的两个主要影响因素。这两种损耗机制会影响所有晶体管,但在一级(L1)缓存的SRAM单元中尤其严重,这些单元经常被访问,对微处理器性能至关重要。这项工作研究了由于BTI和HCI对不同缓存配置的综合影响而导致的缓存生命周期,包括缓存大小、结合性、缓存行大小和替换算法的变化。还考虑了工艺变化的影响。我们分析了LEON3微处理器内L1缓存的可靠性(故障概率)和性能(命中率),而LEON3正在运行一组基准测试,我们为缓存设计人员提供了关于性能可靠性权衡的基本见解。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
SRAM stability analysis for different cache configurations due to Bias Temperature Instability and Hot Carrier Injection
Bias Temperature Instability (BTI) and Hot Carrier Injections (HCI) are two of the main effects that increase a transistor's threshold voltage and further cause performance degradations. These two wearout mechanisms affect all transistors, but are especially acute in the SRAM cells of first-level (L1) caches, which are frequently accessed and are critical for microprocessor performance. This work studies the cache lifetimes due to the combined effect of BTI and HCI for different cache configurations, including variation in cache size, associativity, cache line size, and the replacement algorithm. The effect of process variations is also considered. We analyze the reliability (failure probability) and performance (hit rate) of the L1 cache within a LEON3 microprocessor, while the LEON3 is running a set of benchmarks, and we provide essential insights on performance-reliability tradeoffs for cache designers.
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