非破坏性热声法测定晶体管金属封装气密性

19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) Pub Date : 2013-12-02 DOI:10.1109/THERMINIC.2013.6675240

M. Kubicki, Miroslaw Malmski

{"title":"非破坏性热声法测定晶体管金属封装气密性","authors":"M. Kubicki, Miroslaw Malmski","doi":"10.1109/THERMINIC.2013.6675240","DOIUrl":null,"url":null,"abstract":"The paper presents a new, nondestructive method of determination of the air-tightness of metal packagings of transistors. This method is based on the thermoacoustic approach with a microphone detection. Thermoacoustic approach means that the sound is generated by the periodical temperature of the element caused by the periodical electric power dissipation in it. In the paper both the experimental thermoacoustic frequency characteristics as also the theoretical approach applied for numerical interpretations of experimental data are presented and discussed.","PeriodicalId":369128,"journal":{"name":"19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)","volume":"43 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2013-12-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"The nondestructive thermoacoustic method of determination of the air-tightness of metal packagings of transistors\",\"authors\":\"M. Kubicki, Miroslaw Malmski\",\"doi\":\"10.1109/THERMINIC.2013.6675240\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The paper presents a new, nondestructive method of determination of the air-tightness of metal packagings of transistors. This method is based on the thermoacoustic approach with a microphone detection. Thermoacoustic approach means that the sound is generated by the periodical temperature of the element caused by the periodical electric power dissipation in it. In the paper both the experimental thermoacoustic frequency characteristics as also the theoretical approach applied for numerical interpretations of experimental data are presented and discussed.\",\"PeriodicalId\":369128,\"journal\":{\"name\":\"19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)\",\"volume\":\"43 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2013-12-02\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/THERMINIC.2013.6675240\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/THERMINIC.2013.6675240","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 2

摘要

提出了一种无损测定晶体管金属封装气密性的新方法。该方法是基于热声方法与麦克风检测。热声方法是指由元件内部周期性的电功率耗散引起的元件的周期性温度产生声音。本文介绍并讨论了实验热声频率特性和实验数据数值解释的理论方法。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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The nondestructive thermoacoustic method of determination of the air-tightness of metal packagings of transistors

The paper presents a new, nondestructive method of determination of the air-tightness of metal packagings of transistors. This method is based on the thermoacoustic approach with a microphone detection. Thermoacoustic approach means that the sound is generated by the periodical temperature of the element caused by the periodical electric power dissipation in it. In the paper both the experimental thermoacoustic frequency characteristics as also the theoretical approach applied for numerical interpretations of experimental data are presented and discussed.

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19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)

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