亚10nm域基于6T和8T非对称迭层FinFET sram的性能和可靠性

M. Mohammed, Athiya Nizam, M. Chowdhury
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引用次数: 2

摘要

本文在降低电源电压500mV的情况下,测试了采用高离子/IOFF比的非对称欠叠finfet优化的6T和8T SRAM电路的性能和可靠性。两种SRAM设计的性能在读写操作期间进行评估。与8T SRAM相比,6T SRAM的读能量提高了44.97%。然而,与8T SRAM相比,6T SRAM的写能量下降了3.16%。采用静态噪声裕度法和n曲线法确定SRAM单元的读稳定性和写能力。此外,还对SRAM单元进行了蒙特卡罗模拟,以评估工艺变化。采用7nm非对称Underlap FinFET技术在HSPICE中进行了仿真。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Performance and Reliability of Asymmetrical Underlapped FinFET based 6T and 8T SRAMs in Sub-10nm Domain
In this paper, the performance and reliability of optimized 6T and 8T SRAM circuits using high ION/IOFF ratio Asymmetrical Underlapped FinFETs are determined at a reduced supply voltage of 500mV. Performance of both SRAM designs are evaluated during read and write operations. 6T SRAM achieves 44.97% improvement in the read energy compared to 8T SRAM. However, 6T SRAM write energy degraded by 3.16% compared to 8T SRAM. Read stability and write ability of SRAM cells are determined using Static Noise Margin and N-curve methods. Moreover, Monte Carlo simulations are performed on the SRAM cells to evaluate process variations. Simulations were done in HSPICE using 7nm Asymmetrical Underlap FinFET technology.
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