从分子结构理解玻璃自旋(SOG)性质

Proceedings., Sixth International IEEE VLSI Multilevel Interconnection Conference Pub Date : 1989-06-12 DOI:10.1109/VMIC.1989.78000

C. Chiang, D. Fraser

{"title":"从分子结构理解玻璃自旋(SOG)性质","authors":"C. Chiang, D. Fraser","doi":"10.1109/VMIC.1989.78000","DOIUrl":null,"url":null,"abstract":"A summary of various types of SOG materials and their properties is presented. The authors correlate these properties with molecular structure and constituents such as phosphorous and methyl dopants. Process integration issues associated with each type of SOG material are also discussed.<<ETX>>","PeriodicalId":302853,"journal":{"name":"Proceedings., Sixth International IEEE VLSI Multilevel Interconnection Conference","volume":"126 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1989-06-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"14","resultStr":"{\"title\":\"Understanding of spin-on-glass (SOG) properties from their molecular structure\",\"authors\":\"C. Chiang, D. Fraser\",\"doi\":\"10.1109/VMIC.1989.78000\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A summary of various types of SOG materials and their properties is presented. The authors correlate these properties with molecular structure and constituents such as phosphorous and methyl dopants. Process integration issues associated with each type of SOG material are also discussed.<<ETX>>\",\"PeriodicalId\":302853,\"journal\":{\"name\":\"Proceedings., Sixth International IEEE VLSI Multilevel Interconnection Conference\",\"volume\":\"126 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1989-06-12\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"14\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings., Sixth International IEEE VLSI Multilevel Interconnection Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/VMIC.1989.78000\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings., Sixth International IEEE VLSI Multilevel Interconnection Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/VMIC.1989.78000","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 14

摘要

综述了各类SOG材料及其性能。作者将这些特性与分子结构和成分(如磷和甲基掺杂剂)联系起来。还讨论了与每种SOG材料相关的工艺集成问题。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Understanding of spin-on-glass (SOG) properties from their molecular structure

A summary of various types of SOG materials and their properties is presented. The authors correlate these properties with molecular structure and constituents such as phosphorous and methyl dopants. Process integration issues associated with each type of SOG material are also discussed.<>

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Proceedings., Sixth International IEEE VLSI Multilevel Interconnection Conference

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