Technical Condition Monitoring of Impedance Bonds using Sensors and Dedicated Device

In nowadays, sensors technologies have expanded rapidly and have become cheaper. This has run to an increasing development in condition monitoring of systems, installations, structures, vehicles and also in railway transportation infrastructure using sensors and monitoring devices. This paper it proposes to present an experimental model of a monitoring device and its sensors for acquire data from an important electrical equipment of power supply system from electric traction, named impedance bond. The parameters which are acquired for that equipment are considered important and will lead to know its thermal stresses and real technical condition.