芳纶/环氧基板增加了刚性-柔性基板的高性能使用设施

40th Conference Proceedings on Electronic Components and Technology Pub Date : 1990-05-20 DOI:10.1109/ECTC.1990.122296

E. Tsunashima, A. Okuno, N. Oyama, T. Hirakawa, K. Nishimura

{"title":"芳纶/环氧基板增加了刚性-柔性基板的高性能使用设施","authors":"E. Tsunashima, A. Okuno, N. Oyama, T. Hirakawa, K. Nishimura","doi":"10.1109/ECTC.1990.122296","DOIUrl":null,"url":null,"abstract":"A material has been developed for fabricating rigid-flexible printed boards. The material includes copper-clad laminates (TL-01) and prepregs (ET-100) consisting of a recently developed aramid paper made of an aramid fiber from poly-paraphenylene 3,4' diphenilether terephthalamid (PPDETA) as a reinforcement, and a sophisticated epoxy resin system having high affinity to an aramid fiber as an impregnant. The dimensional stability of the multilayer system has been shown to surpass that of the conventional lamination system of FR-4, polyimide films, and acrylic adhesives. A flexural fatigue test on the flexible printed wiring has been carried out, and the flexible material revealed a higher flexibility than FR-4. Copper migration has been observed after full absorption of moisture by a pressure cooker test (PCT). TL-01 has shown an excellent resistance to migration for more than 50 h, while polyimide film with an acrylic adhesive has shown a heavy migration. It is concluded that this material may be useful for advanced rigid-flex multilayer printed boards suitable for surface mount technologies.<<ETX>>","PeriodicalId":102875,"journal":{"name":"40th Conference Proceedings on Electronic Components and Technology","volume":"2 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1990-05-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"An aramid/epoxy substrates increased the facility of rigid-flexible substrates for high performance use\",\"authors\":\"E. Tsunashima, A. Okuno, N. Oyama, T. Hirakawa, K. Nishimura\",\"doi\":\"10.1109/ECTC.1990.122296\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A material has been developed for fabricating rigid-flexible printed boards. The material includes copper-clad laminates (TL-01) and prepregs (ET-100) consisting of a recently developed aramid paper made of an aramid fiber from poly-paraphenylene 3,4' diphenilether terephthalamid (PPDETA) as a reinforcement, and a sophisticated epoxy resin system having high affinity to an aramid fiber as an impregnant. The dimensional stability of the multilayer system has been shown to surpass that of the conventional lamination system of FR-4, polyimide films, and acrylic adhesives. A flexural fatigue test on the flexible printed wiring has been carried out, and the flexible material revealed a higher flexibility than FR-4. Copper migration has been observed after full absorption of moisture by a pressure cooker test (PCT). TL-01 has shown an excellent resistance to migration for more than 50 h, while polyimide film with an acrylic adhesive has shown a heavy migration. It is concluded that this material may be useful for advanced rigid-flex multilayer printed boards suitable for surface mount technologies.<<ETX>>\",\"PeriodicalId\":102875,\"journal\":{\"name\":\"40th Conference Proceedings on Electronic Components and Technology\",\"volume\":\"2 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1990-05-20\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"40th Conference Proceedings on Electronic Components and Technology\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ECTC.1990.122296\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"40th Conference Proceedings on Electronic Components and Technology","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC.1990.122296","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 1

摘要

开发了一种用于制造刚柔印制板的材料。该材料包括覆铜层压板(TL-01)和预浸料(ET-100)，由最近开发的芳纶纸组成，芳纶纤维由聚对苯二烯3,4'二苯醚对苯二甲酸(PPDETA)作为增强剂制成，并以芳纶纤维作为浸渍剂具有高亲和力的复杂环氧树脂体系制成。多层体系的尺寸稳定性已被证明优于FR-4、聚酰亚胺薄膜和丙烯酸胶粘剂的传统层压体系。对柔性印刷线材进行了弯曲疲劳试验，结果表明柔性材料具有比FR-4更高的柔韧性。通过压力锅试验(PCT)观察到铜在完全吸收水分后的迁移。TL-01表现出优异的耐迁移50小时以上，而聚酰亚胺薄膜与丙烯酸粘合剂表现出严重的迁移。由此得出结论，该材料可用于适用于表面贴装技术的先进刚性-柔性多层印制板。

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An aramid/epoxy substrates increased the facility of rigid-flexible substrates for high performance use

A material has been developed for fabricating rigid-flexible printed boards. The material includes copper-clad laminates (TL-01) and prepregs (ET-100) consisting of a recently developed aramid paper made of an aramid fiber from poly-paraphenylene 3,4' diphenilether terephthalamid (PPDETA) as a reinforcement, and a sophisticated epoxy resin system having high affinity to an aramid fiber as an impregnant. The dimensional stability of the multilayer system has been shown to surpass that of the conventional lamination system of FR-4, polyimide films, and acrylic adhesives. A flexural fatigue test on the flexible printed wiring has been carried out, and the flexible material revealed a higher flexibility than FR-4. Copper migration has been observed after full absorption of moisture by a pressure cooker test (PCT). TL-01 has shown an excellent resistance to migration for more than 50 h, while polyimide film with an acrylic adhesive has shown a heavy migration. It is concluded that this material may be useful for advanced rigid-flex multilayer printed boards suitable for surface mount technologies.<>

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来源期刊

40th Conference Proceedings on Electronic Components and Technology

CiteScore

3.10

自引率

0.00%

发文量