Study on Measurement Method of Microscopic $\zeta$ Potential

A material removal rate in CMP process is affected by a frequency of contact between the abrasives and the wafer because of the electrostatic interaction. Control of ζpotential in a micro region was considered to be a key for slurry design, and research on its measurement method was conducted. FD curve was measured in liquid using AFM. As a result, it was found that load of the cantilever observed during the jump-in strongly reflects the ζpotential. Furthermore, we achieved to measure microscopic ζpotential on the patterned wafer.