Ar/ n2等离子溅射压力对HfN等离子体氧化形成的HfON隧穿层电特性的依赖

J. Pyo, H. Morita, A. Ihara, Ohmi Shun-ichiro
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引用次数: 0

摘要

本文研究了氩/氮等离子溅射压力对hf基金属-氧化物-氮-氧化物-硅(MONOS)二极管中HfN等离子氧化形成的隧穿层(TL)电学特性的依赖关系。在0.04 Pa条件下对HfN进行Ar/O2等离子体氧化制备的HfON薄膜质量得到改善,等效氧化厚度仅为0.84 nm,具有良好的MONOS特性,迟滞可忽略,程序记忆窗口为4 V,擦除电压/时间为±8 V/100 ms。此外,在0.04 Pa的MONOS二极管下沉积的HfN经Ar/O2等离子体氧化形成的HfON TL具有更好的持久和保留特性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Ar/N2-plasma Sputtering Pressure Dependence on Electrical Characteristics of HfON Tunneling Layer Formed by the Plasma Oxidation of HfN for Hf-Based MONOS Diodes
This paper investigated Ar/N2-plasma sputtering pressure dependence on electrical characteristics of HfON tunneling layer (TL) formed by the plasma oxidation of HfN for Hf-based Metal-Oxide-Nitride-Oxide-Silicon (MONOS) diodes. The HfON formed by the Ar/O2 plasma oxidation of HfN deposited at 0.04 Pa showed improved film quality and small equivalent oxide thickness of 0.84 nm, which realized excellent MONOS characteristics such as negligible hysteresis, and memory window of 4 V at the program and erase voltage/time of ±8 V/100 ms. Moreover, HfON TL formed by Ar/O2 plasma oxidation of HfN deposited at 0.04 Pa MONOS diode shows improved endurance and retention characteristics.
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