光PCB互连,利基还是主流?

I. Fujimori, Seonghwan Cho, J. Friedrich, J. Stonick
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引用次数: 0

摘要

只提供摘要形式。使用现代技术的单片信息处理系统的持续扩展使得使用铜的传统电气互连在许多应用中成为数据流量的瓶颈。光学背板和技术领域的努力已经进行了几年,由于其在功率、密度和速度方面的潜在优势,引起了人们的极大兴趣。最近,这些努力引起了关于在印刷电路板上芯片对芯片通信的嵌入式光学作用的讨论。最重要的是,与CMOS技术兼容的硅光子学的进步加速了这一讨论。大型机和高端服务器的PCB互连将利用光学技术,这似乎正在形成共识,但这些方法会成为主流吗?
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Optical PCB interconnects, Niche or mainstream?
Summary form only given. The continued scaling of information processing systems-on-a-chip using modern technology have made conventional electrical interconnects using copper the bottleneck for data traffic in many applications. Efforts in the area of optical backplane and technology have been underway for several years, generating significant interest due to its potential benefits in power, density and speed. Recently, these efforts have led to discussions regarding the role of embedded optics for chip to chip communication on printed circuit boards. Most signficantly, the advancement in silicon photonics compatible to CMOS technology have accelerated this discussion. A consensus appears to be emerging that PCB interconnects for mainframes and high-end servers will leverage optical technologies, but will these approaches ever go mainstream?
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