多通孔EBG结构的阻带分析

Yan Zhang, Wei Zhang, Tao Hong, Shan-wei Lu, Xiao-ning Ni
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引用次数: 3

摘要

分析了新型多通孔EBG结构的带隙特性。首先,将多通孔结构分别应用于方形和六边形EBG结构。同时考虑了对角线方向通过和轴向通过两种情况。其次,对多孔方形和多孔六边形EBG结构进行了仿真。并将多通孔EBG结构的带隙参数(带宽和中心频率)与蘑菇型EBG结构的带隙参数进行了比较。此外,还研究了多通孔布置对阻带带宽和阻带中心频率的影响,如边通孔位置和中心通孔与边通孔之间的距离。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Stop-band analysis of multi-via EBG structure
The band-gap property of novel multi-via EBG structure is analyzed in this paper. Firstly, the multi-via structure is applied into square and hexagonal EBG structures, respectively. Both the diagonal-direction-via case and the axis-direction-via case are considered. Secondly, the multi-via square and the multi-via hexagonal EBG structures are simulated. And the band-gap parameters of multi-via EBG structures, including bandwidth and center frequency, are compared with those of the mushroom-like EBG structure. In addition, the effect of the multi-via placement, such as the edge-via position and the distance between center via and edge via, on stop-band bandwidth and stop-band center frequency is investigated.
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