{"title":"用于硅膜面外位移和微形状测量的干涉测量系统","authors":"M. Józwik, A. Sabac, C. Gorecki","doi":"10.1117/12.517118","DOIUrl":null,"url":null,"abstract":"In this paper we introduce a conventional interferometry system for MEMS/MOEMS characterization. We investigate the opto-mechanical properties of silicon micromembranes, where a thin film of PECVD SiOxNy was deposited. Monitoring the quality of this deposition we demonstrated the fabrication of technology for optical channel waveguides, compatible with the integration on micromechanical structures: based on low-stress and low-loss SiOxNy thin layers.","PeriodicalId":405495,"journal":{"name":"Optoelectronic and Electronic Sensors","volume":"71 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2003-09-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Interferometry system for out-of-plane displacements and microshape measurements of silicon membranes\",\"authors\":\"M. Józwik, A. Sabac, C. Gorecki\",\"doi\":\"10.1117/12.517118\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this paper we introduce a conventional interferometry system for MEMS/MOEMS characterization. We investigate the opto-mechanical properties of silicon micromembranes, where a thin film of PECVD SiOxNy was deposited. Monitoring the quality of this deposition we demonstrated the fabrication of technology for optical channel waveguides, compatible with the integration on micromechanical structures: based on low-stress and low-loss SiOxNy thin layers.\",\"PeriodicalId\":405495,\"journal\":{\"name\":\"Optoelectronic and Electronic Sensors\",\"volume\":\"71 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2003-09-22\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Optoelectronic and Electronic Sensors\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1117/12.517118\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Optoelectronic and Electronic Sensors","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1117/12.517118","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Interferometry system for out-of-plane displacements and microshape measurements of silicon membranes
In this paper we introduce a conventional interferometry system for MEMS/MOEMS characterization. We investigate the opto-mechanical properties of silicon micromembranes, where a thin film of PECVD SiOxNy was deposited. Monitoring the quality of this deposition we demonstrated the fabrication of technology for optical channel waveguides, compatible with the integration on micromechanical structures: based on low-stress and low-loss SiOxNy thin layers.