全球覆铜板市场预测分析

Yu-Yao Hsiao, Fu‐Kwun Wang
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引用次数: 4

摘要

需求预测是企业高层管理者制定未来投资战略决策的重要依据之一。覆铜层压板(CCL)是印刷电路板(PCB)的关键材料,可应用于消费、计算机、LCD、通信、汽车、航空航天、医药和国防等领域。2008年PCB的全球总销售额为482亿美元。本文采用灰色模型GM(1,1)、滚动灰色模型(RGM)和Bass扩散模型对2001-2008年全球覆铜板市场进行了分析,分为纸、复合、FR-4、FR-4高Tg、FR-4无卤、特种6个细分市场。利用平均绝对百分比误差(MAPE)对全球六大细分市场CCL市场的预测精度进行了评估。在本研究中,Bass扩散模型MAPE在全球CCL市场预测分析中优于其他两个模型GM(1,1)和RGM,被推荐用于全球CCL市场预测分析。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Forecasting analysis for global copper clad laminate market
Demand forecasting is one of critical reference by top managers to make the strategy decision for future investment. The copper clad laminate(CCL) is the key material for print circuit board(PCB) and it can apply for consumer, computer, LCD, communication, automotive, aero space, medicine and defense application. The total global sale for PCB in 2008 is US$ 48.2 billion. In this research, we use grey model GM(1,1), rolling grey model(RGM) and Bass diffusion model to analysis global CCL market by six market segments — paper, composite, FR-4, FR-4 High Tg, FR-4 halogen free, Specialty between 2001–2008. The forecasting accuracy of global CCL market by six market segment was evaluated along with mean absolute percentage error(MAPE). In this study, Bass diffusion model MAPE outperforms the others two models GM(1,1) and RGM for this global CCL market forecasting analysis and is recommend for global CCL market forecasting analysis.
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