采用三维主片MMIC技术的LMDS上下转换器芯片组

1999 IEEE Radio Frequency Integrated Circuits Symposium (Cat No.99CH37001) Pub Date : 1999-06-13 DOI:10.1109/RFIC.1999.805257

I. Toyoda, F. Sugihara, Y. Maki, Y. Imai

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引用次数: 9

摘要

三维主片MMIC技术实现了MMIC的快速发展。本文讨论了用于LMDS上下变换器的微型混频器和放大器。采用新设计的主阵列，开发了均匀谐波混频器、阻性混频器、平衡阻性混频器和放大器。这些电路覆盖了LMDS频段，可以很容易地集成到单个芯片上，在很短的周转时间内构建一个高度集成的多功能MMIC。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Up- and down-converter chip set for LMDS using three-dimensional masterslice MMIC technology

Three-dimensional masterslice MMIC technology enables quick development of MMICs. This paper discusses miniature mixers and amplifiers for LMDS up- and down-converters. An even-harmonic mixer, a resistive mixer, a balanced-resistive mixer, and amplifiers were developed using newly designed master arrays. These circuits cover the LMDS band and can be easily integrated into a single chip to build a highly integrated multifunctional MMIC in a very short turn-around-time.

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1999 IEEE Radio Frequency Integrated Circuits Symposium (Cat No.99CH37001)

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