利用实时故障位图分析加速产量提高活动

2001 IEEE International Symposium on Semiconductor Manufacturing. ISSM 2001. Conference Proceedings (Cat. No.01CH37203) Pub Date : 2001-10-08 DOI:10.1109/ISSM.2001.962965

W. Shindo, S. Sugimoto, R. Makara, Puttachai Rattanalangkan, R. Lui

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引用次数: 2

摘要

提出了一种利用故障位图(FBM)分析来提高基准产率的方法。通过FBM-缺陷关联和FBM分类来估计每个工艺步骤的良率影响。数据的统计准确性通过使用晶圆厂的实际晶圆差异来评估，并通过增加FBM样本量显着提高。为了实时分析大量数据，还通过自动化系统及时反馈数据以提高产量，从而提高数据分析的吞吐量。

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Acceleration of yield enhancement activity by utilizing real-time fail bitmap analysis

A methodology to enhance baseline yield by utilizing fail bitmap (FBM) analysis is presented in this paper. Yield impact of each process step is estimated from FBM-defect correlation and FBM classification. Statistical accuracy of the data is evaluated by using actual wafer-to-wafer variation of our fab, and is significantly improved by increasing FBM sample size. In order to analyze a large amount of data in real-time manner, throughput of the data analysis is also enhanced by an automated system for timely data feedback to yield enhancement activities.

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来源期刊

2001 IEEE International Symposium on Semiconductor Manufacturing. ISSM 2001. Conference Proceedings (Cat. No.01CH37203)

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