包括布局寄生的EMI改进型折叠级联放大器输入级的噪声特性

N. Czepl, Dominik Zupan
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引用次数: 0

摘要

本文研究了电磁干扰(EMI)改进集成折叠级联放大器输入级的噪声特性。在这种情况下,我们比较了七种EMI改进的差分输入对结构,使用滤波,线性化和补偿的概念,就其噪声行为而言。我们在设计阶段和布局阶段特别注意结构行为的差异,在布局阶段我们还考虑了可能影响电路和噪声性能的布局特定寄生。我们从输入参考噪声、不同器件的噪声贡献、布局寄生对噪声的贡献、差分模式增益、增益带宽积(GBWP)和功率等方面分析了该结构。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Noise Behaviour of EMI Improved Folded Cascode Amplifier Input Stages Including Layout Parasitics
In this paper we investigate the noise behaviour of electromagnetic interference (EMI) improved integrated folded cascode amplifier input stages. In this context we compare seven EMI improved differential input pair structures, using concepts of filtering, linearisation and compensation in terms of their noise behaviour. We pay special attention to the differences in the behaviour of the structures at the design stage and the layout stage, where we also considered layout-specific parasitics that can affect circuit and noise performance. We analyse the structures in terms of input referred noise, noise contribution of different devices, contributions of layout parasitics to noise, differential mode gain, gain-bandwidth product (GBWP) and power.
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