微波通信系统中衬底集成波导的小型化趋势

2022 2nd International Conference on Innovative Research in Applied Science, Engineering and Technology (IRASET) Pub Date : 2022-03-03 DOI:10.1109/IRASET52964.2022.9738295

Souad Akkader, Hamid Bouyghf, A. Baghdad

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引用次数: 0

摘要

基板集成波导结构具有体积小、损耗低、制造成本低等优点，是微波和毫米波通信系统中器件的新兴候选器件。近年来，固体废物小型化日益发展。本文介绍了全模SIW (FMSIW)、八模SIW (EMSIW)和十六模SIW (SMSIW)的链路及其附加优点。本文可为分析近年来衬底集成波导的小型化提供指导，并可为微波元件特别是小尺寸系统的设计提供指导。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Miniaturization Trends in Substrate Integrated Waveguide for Microwave Communication Systems

Substrate integrated waveguide structure is an emerging candidate for the components operating within the microwave and millimeter-wave communication system due to its multiple advantages: compact size, low losses, and low fabrication cost. Recently miniaturization of SIW is taking place day by day. In this article, the link of full-mode SIW (FMSIW), eighth-mode SIW (EMSIW), and sixteenth mode SIW (SMSIW) has been presented with their additional advantages. This paper may be a guideline of the analysis of recent miniaturization of substrate integrated waveguides and it can provide a design guideline of microwave components especially in small-size systems.

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2022 2nd International Conference on Innovative Research in Applied Science, Engineering and Technology (IRASET)

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