CMOS芯片间数字传输的半导电耦合互连技术

Proceedings of the IEEE 2000 International Interconnect Technology Conference (Cat. No.00EX407) Pub Date : 2000-06-05 DOI:10.1109/IITC.2000.854333

W. Pan, F. Devisch, C. De Tandt, R. Vounckx, M. Kuijk

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引用次数: 4

摘要

本文首次介绍了如何利用半导电耦合(hc -耦合)实现两个倒装标准CMOS芯片之间的数字互连。为了简化工艺，hc层可以无图案化，CMOS芯片不需要任何后处理步骤。由于屏蔽效应，该技术有望实现超高密度互连。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Half-conductive coupling interconnection technology for digital transmission between CMOS chips

This paper describes for the first time how to use half-conductive coupling (HC-coupling) to obtain digital interconnections between two flip-chipped standard CMOS chips. For process simplicity, the HC-layer can be unpatterned and the CMOS chips do not require any post-processing steps. Due to shielding effects, the technology promises ultra-high-density interconnections.

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Proceedings of the IEEE 2000 International Interconnect Technology Conference (Cat. No.00EX407)

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