高压4H-SiC引脚整流器,单植入,多区域JTE终端

P. Losee, S. Balachandran, L. Zhu, C. Li, J. Seiler, T. Chow, I. Bhat, R. Gutmann
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引用次数: 21

摘要

提出了一种用于高压4H-SiC引脚结整流器的新型多区结端接扩展(MZJTE)。与传统的多植入或SiC蚀刻方法不同,我们的新终端技术利用多个掩蔽氧化物蚀刻步骤来实现保持表面平面度的单植入MZJTE结构。与单区JTE相比,采用数值装置模拟来检验该工艺的灵敏度,得到的击穿电压接近理想平行平面击穿电压的90%。制作了高电压(V/sub / BR//spl / ap/ 8kv)整流器,并测量了实验特性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
High-voltage 4H-SiC PiN rectifiers with single-implant, multi-zone JTE termination
A novel multi-zone junction termination extension (MZJTE) is presented for high-voltage 4H-SiC pin junction rectifiers. Unlike the conventional multi-implantation or SiC etching approaches, our new termination technique utilizes multiple masking oxide etching steps to achieve a single-implant MZJTE structure that maintains surface planarity. Numerical device simulations have been performed to examine the process sensitivities, compared to single-zone JTE, and yielded breakdown voltages close to 90% of the ideal parallel-plane breakdown voltage. High voltage (V/sub BR//spl ap/8 kV) rectifiers were fabricated and experimental characteristics have been measured.
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