体波和表面波器件的蚀刻加工

J. Dowsett, D.F.G. Dwyer, F. Stern, R. Heinecke, A. Truelove
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引用次数: 6

摘要

体波器件的蚀刻加工是一种发展中的技术,它不再受机械加工的频率上限限制。然而,使用化学或等离子体工艺对材料质量和最终蚀刻之前的机械工艺施加了其他规则。本文讨论了在生产大体积硅藻土中所采用的工艺和取得的成果。e谐振器在基模中使用AT-cut,最高可达150 MHz。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Etch Processing of Bulk and Surface Wave Devices
Etch processing of bulk wave devices is a developing technique where the upper frequency limitation of the mechanical processes can no longer be applied. However, the use of chemical or plasma processes imposes other disciplines with regard to the quality of the material and to the mechanical processes preceding the final etch. This paper discusses the techniques and the results achieved in the manufacture of bulk wa-!e resonators up to l50 MHz in the fundamental mode using the AT-cut.
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