L. W. Linholm, R. Allen, M. Cresswell, R. Ghoshtagore, S. Mayo, H. Schafft, J. Kramar, E. Teague
{"title":"互连表征用图像化薄膜线宽的测量","authors":"L. W. Linholm, R. Allen, M. Cresswell, R. Ghoshtagore, S. Mayo, H. Schafft, J. Kramar, E. Teague","doi":"10.1109/ICMTS.1995.513939","DOIUrl":null,"url":null,"abstract":"Test results from high-quality electrical and physical measurements on the same cross-bridge resistor test structure with approximately vertical sidewalls have shown differences in linewidth as great as 90 nm for selected conductive films. These differences were independent of design linewidth. As dimensions become smaller, the accurate measurement of the patterned conductor width is necessary to assure predictable timing performance of the interconnect system as well as control of critical device parameters.","PeriodicalId":432935,"journal":{"name":"Proceedings International Conference on Microelectronic Test Structures","volume":"69 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1995-03-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"13","resultStr":"{\"title\":\"Measurement of patterned film linewidth for interconnect characterization\",\"authors\":\"L. W. Linholm, R. Allen, M. Cresswell, R. Ghoshtagore, S. Mayo, H. Schafft, J. Kramar, E. Teague\",\"doi\":\"10.1109/ICMTS.1995.513939\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Test results from high-quality electrical and physical measurements on the same cross-bridge resistor test structure with approximately vertical sidewalls have shown differences in linewidth as great as 90 nm for selected conductive films. These differences were independent of design linewidth. As dimensions become smaller, the accurate measurement of the patterned conductor width is necessary to assure predictable timing performance of the interconnect system as well as control of critical device parameters.\",\"PeriodicalId\":432935,\"journal\":{\"name\":\"Proceedings International Conference on Microelectronic Test Structures\",\"volume\":\"69 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1995-03-22\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"13\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings International Conference on Microelectronic Test Structures\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICMTS.1995.513939\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings International Conference on Microelectronic Test Structures","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICMTS.1995.513939","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Measurement of patterned film linewidth for interconnect characterization
Test results from high-quality electrical and physical measurements on the same cross-bridge resistor test structure with approximately vertical sidewalls have shown differences in linewidth as great as 90 nm for selected conductive films. These differences were independent of design linewidth. As dimensions become smaller, the accurate measurement of the patterned conductor width is necessary to assure predictable timing performance of the interconnect system as well as control of critical device parameters.