带剥离的双材料带材在张力作用下的应力分析

N. Hasebe, Seiji Kato, Atsusi Ueda, Takuji Nakamura
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引用次数: 12

摘要

解决了两端粘接的条的双材料问题。结合的部分是一个部分,脱键发生在界面的两侧。改变剥离长度,并在每个条带的尖端施加集中载荷。采用复变法和有理映射函数进行分析。应力分布显示了两个不同位置的界面。定义了剥离的应力强度,得到了不同剥离长度下的应力强度值。研究了材料常数对脱粘效果的影响。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Stress Analysis of Bimaterial Strip with Debondings under Tension
A bimaterial problem of strips which are bonded at their ends is solved. The bonded part is one part and debondings occur on both sides of the interface. The debonding lengths are changed, and concentrated loads are applied at the tips of each strip. The complex variable method and a rational mapping function are used for the analysis. Stress distributions are shown for two different locations of the interface. Stress intensity of debonding is defined and the values are obtained for various debonding lengths. Debonding and the effect of material constants on debonding are also investigated.
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