资本生产率——挑战与机遇

W. Rowe
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引用次数: 0

摘要

只提供摘要形式。控制半导体晶圆制造商快速增长的成本是半导体行业面临的严峻挑战。SEMATECH与其成员和SEMI/SEMATECH供应商合作,开发了一种方法,以保持半导体产品的每个功能的历史价格下降率。SEMATECH开发了一系列0.25微米晶圆代工厂成本模型。这些模型结合了先进的逻辑和DRAM流程、运营和财务投入以及设备成本和性能目标。该模型的晶圆加工成本与SEMATECH竞争分析小组开发的可负担成本进行了比较。这一过程的结果是为0.25微米一代设备制定了一套双方商定的成本和性能目标。满足这些目标的设备将比目前可用的设备更具成本效益。以整体设备效率(OEE)衡量的高运行效率对于实现提高资本生产率的目标至关重要。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Capital productivity-challenge and opportunity
Summary form only given. Controlling the rapidly increasing costs of semiconductor wafer fabricators presents a serious challenge to the semiconductor industry. SEMATECH, in cooperation with its members and SEMI/SEMATECH suppliers has developed a methodology to maintain the historic price per function decline rate for semiconductor products. A series of 0.25 micron generation fab cost models were developed at SEMATECH. The models incorporated advanced logic and DRAM processes, operational and financial inputs and equipment cost and performance goals. Wafer processing costs from the model were compared to affordable costs developed by the SEMATECH Competitive Analysis Group. The result of this process has been a set of mutually agreed upon cost and performance targets for the 0.25 micron generation of equipment. Equipment meeting those targets will be more cost effective than that currently available. High operating efficiency as measured by overall equipment effectiveness (OEE) is essential to achieving improved capital productivity goals.
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