用于低功率电机驱动器的传输模具封装中的紧凑ipm

2004 Proceedings of the 16th International Symposium on Power Semiconductor Devices and ICs Pub Date : 2004-05-24 DOI:10.1109/WCT.2004.240144

G. Majumdar, M. Iwasaki, M. Fukunaga, X. Kong

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引用次数: 4

摘要

本文介绍了一种用于低功率电机驱动的优秀功率模块系列。DIP-IPM(双列直插式封装智能功率模块)，以其传输模封装概念，是最受欢迎的器件，特别是在当今的消费级逆变器市场，其性价比高，可靠性高。本文介绍了这种IPM的特点和支持这种成功器件系列的背景技术。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Compact IPMs in transfer mold packages for low-power-motor drives

This paper presents an excellent power module family for low power motor drives. The DIP-IPM (dual in-line package intelligent power module), with its transfer-mold packaging concept, is the most popular device, especially in today's consumer inverter market, for its cost-effective performance and high reliability. In this paper, the features of this kind of IPM and the background technologies supporting this successful device family are described.

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2004 Proceedings of the 16th International Symposium on Power Semiconductor Devices and ICs

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