双vt 4kb子vt存储器,在65nm CMOS中泄漏小于1 pW/bit

O. Andersson, B. Mohammadi, P. Meinerzhagen, A. Burg, J. Rodrigues
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引用次数: 15

摘要

提出了两种基于标准细胞的阈下记忆(sub-VT)。单片机完成了鲁棒子vt存储的任务,填补了子vt存储编译器的空白。这些scm的存储元件(锁存器)是定制设计的单元,采用双vt方法来提高可靠性和平衡时序。此外,还提出了两种读逻辑风格:1)分段三状态实现,与纯三状态实现相比,该实现提高了性能;2)一个纯粹基于mux的实现,将第一阶段(NAND门)集成到存储单元中。对采用低功耗65nm CMOS技术制造的两个4kb单片机的硅测量表明,与纯3态实现相比,分段3态和集成NAND的读取访问速度分别提高了4倍和8倍,而位访问能量分别仅增加了2.7倍和2倍,分别达到39和29 fJ。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Dual-VT 4kb sub-VT memories with <1 pW/bit leakage in 65 nm CMOS
Two standard-cell based subthreshold (sub-VT) memories (SCMs) are presented. The SCMs accomplish the task of robust sub-VT storage and fill the gap of missing sub-VT memory compilers. The storage elements (latches) of these SCMs are custom-designed cells using a dual-VT approach to improve reliability and balance timing. Additionally, two read-logic styles are presented: 1) a segmented 3-state implementation that increases performance compared to a pure 3-state implementation; and 2) a purely MUX-based implementation with the first stage (NAND gate) integrated into the storage cell. Silicon measurements of two 4kb SCMs manufactured in a low-power 65nm CMOS technology show that read access speed increases by 4× and 8× compared to a pure 3-state implementation for the segmented 3-state and integrated NAND, respectively, while bit-access energy only increases by 2.7× and 2× to 39 and 29 fJ, respectively.
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