{"title":"新型射频信号处理器集成电路设计的迷你光盘系统","authors":"D. Jang, Dong Cheol Lee, Ho Jin Lee","doi":"10.1109/ICCE.1995.518019","DOIUrl":null,"url":null,"abstract":"This paper presents a new RF signal processor IC for the MD (Mini Disc) system. We developed an RF signal processor IC with higher performance, smaller size and lower power consumption. This chip contains an I/V amplifier, a RF amplifier, an ALPC (automatic laser power control), an ADIP (address in pregroove) demodulator, an FE low band amplifier and switch blocks all in one chip. The IC is fabricated using double metal 0.8 /spl mu/m BiCMOS technology.","PeriodicalId":306595,"journal":{"name":"Proceedings of International Conference on Consumer Electronics","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"1995-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"New RF signal processor IC design for the Mini Disc system\",\"authors\":\"D. Jang, Dong Cheol Lee, Ho Jin Lee\",\"doi\":\"10.1109/ICCE.1995.518019\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper presents a new RF signal processor IC for the MD (Mini Disc) system. We developed an RF signal processor IC with higher performance, smaller size and lower power consumption. This chip contains an I/V amplifier, a RF amplifier, an ALPC (automatic laser power control), an ADIP (address in pregroove) demodulator, an FE low band amplifier and switch blocks all in one chip. The IC is fabricated using double metal 0.8 /spl mu/m BiCMOS technology.\",\"PeriodicalId\":306595,\"journal\":{\"name\":\"Proceedings of International Conference on Consumer Electronics\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1995-11-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of International Conference on Consumer Electronics\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICCE.1995.518019\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of International Conference on Consumer Electronics","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICCE.1995.518019","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
摘要
本文介绍了一种用于微型光盘系统的新型射频信号处理器IC。我们开发了一种性能更高、体积更小、功耗更低的射频信号处理器IC。该芯片包含一个I/V放大器，RF放大器，ALPC(自动激光功率控制)，ADIP(预槽地址)解调器，FE低频段放大器和开关块。该集成电路采用双金属0.8 /spl μ m BiCMOS技术制造。
New RF signal processor IC design for the Mini Disc system
This paper presents a new RF signal processor IC for the MD (Mini Disc) system. We developed an RF signal processor IC with higher performance, smaller size and lower power consumption. This chip contains an I/V amplifier, a RF amplifier, an ALPC (automatic laser power control), an ADIP (address in pregroove) demodulator, an FE low band amplifier and switch blocks all in one chip. The IC is fabricated using double metal 0.8 /spl mu/m BiCMOS technology.
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