新一代硅片转移/储存系统的开发

2001 IEEE International Symposium on Semiconductor Manufacturing. ISSM 2001. Conference Proceedings (Cat. No.01CH37203) Pub Date : 2001-10-08 DOI:10.1109/ISSM.2001.963023

Y. Kanechika, T. Kawaguchi, M. Nagase, T. Jimbo, M. Yamasaki, M. Hirayama, Y. Shirai, T. Ohmi

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引用次数: 1

摘要

洁净室空气中含有多种污染物，如湿气和有机化合物。器件性能受其影响，因此，硅片不应暴露在洁净室空气中。我们开发了下一代硅晶片转移/储存系统，使用无废气先进树脂和CDA(清洁干燥空气)。先进的树脂具有各种有利的性能，硅晶片传输箱和贮存器。例如:(1)不排气，(2)重量轻，(3)透明度高，(4)强度高等。使用先进的树脂，我们开发了一种新的硅晶圆转移舱，称为BORP(底部开口去除舱)。

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Development of the next generation Si wafer transfer/stock system

Clean room air contains many kinds of contaminants such as moisture and organic compounds. The device performance is influenced by them, therefore, Si wafers should not be exposed to clean room air. We have developed the next generation Si wafer transfer/stock system using out-gas free advanced resin and CDA (Clean Dry Air). The advanced resin has various advantageous properties for a Si wafer transfer box and stocker. For example, (1) out-gas free, (2) light weight, (3) high transparency, (4) high strength, etc. Using the advanced resin, we have developed a new Si wafer transfer pod, called BORP (Bottom Opening Removal Pod).

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2001 IEEE International Symposium on Semiconductor Manufacturing. ISSM 2001. Conference Proceedings (Cat. No.01CH37203)

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