根据MIL-STD 883的GaAs MMIC c波段放大器的封装和特性

Ravi Gugulothu, S. Bhalke, S. Chaturvedi
{"title":"根据MIL-STD 883的GaAs MMIC c波段放大器的封装和特性","authors":"Ravi Gugulothu, S. Bhalke, S. Chaturvedi","doi":"10.1109/IMARC.2015.7411436","DOIUrl":null,"url":null,"abstract":"This paper presents the design of 50ohm microstrip line, modelling of the metal ceramic package, packaging and characterization of a GaAs MMIC die in the metal ceramic package with optimised interconnections and validation of its performance parameters. The packaged MMIC was characterized under various environmental conditions like temperature cycling, burn-in test and life tests at as per MIL-STD 883 standard. The MMIC performance was monitored before and after every test condition. The packaged amplifier MMIC resulted in good input /output return losses (better than 17dB), linear gain of 20dB, gain flatness of less than 0.5dB, P1dB of 12dBm. It has shown very low drift in gain of plus/minus 0.22dB against 1dB and variation of 1percent in Ids against 10percent.","PeriodicalId":307742,"journal":{"name":"2015 IEEE MTT-S International Microwave and RF Conference (IMaRC)","volume":"2015 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2015-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Packaging and characterization of GaAs MMIC C-band amplifier as per MIL-STD 883\",\"authors\":\"Ravi Gugulothu, S. Bhalke, S. Chaturvedi\",\"doi\":\"10.1109/IMARC.2015.7411436\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper presents the design of 50ohm microstrip line, modelling of the metal ceramic package, packaging and characterization of a GaAs MMIC die in the metal ceramic package with optimised interconnections and validation of its performance parameters. The packaged MMIC was characterized under various environmental conditions like temperature cycling, burn-in test and life tests at as per MIL-STD 883 standard. The MMIC performance was monitored before and after every test condition. The packaged amplifier MMIC resulted in good input /output return losses (better than 17dB), linear gain of 20dB, gain flatness of less than 0.5dB, P1dB of 12dBm. It has shown very low drift in gain of plus/minus 0.22dB against 1dB and variation of 1percent in Ids against 10percent.\",\"PeriodicalId\":307742,\"journal\":{\"name\":\"2015 IEEE MTT-S International Microwave and RF Conference (IMaRC)\",\"volume\":\"2015 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2015-12-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2015 IEEE MTT-S International Microwave and RF Conference (IMaRC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IMARC.2015.7411436\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2015 IEEE MTT-S International Microwave and RF Conference (IMaRC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IMARC.2015.7411436","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1

摘要

本文介绍了50欧姆微带线的设计,金属陶瓷封装的建模,金属陶瓷封装中的GaAs MMIC芯片的封装和特性,优化了互连,并验证了其性能参数。按照MIL-STD 883标准对封装的MMIC进行了温度循环、老化和寿命测试等多种环境条件下的表征。在每个测试条件之前和之后监测MMIC性能。封装的MMIC放大器具有良好的输入/输出回波损耗(优于17dB),线性增益为20dB,增益平坦度小于0.5dB, P1dB为12dBm。它显示出非常低的增益漂移,±0.22dB相对于1dB, 1%的Ids变化相对于10%。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Packaging and characterization of GaAs MMIC C-band amplifier as per MIL-STD 883
This paper presents the design of 50ohm microstrip line, modelling of the metal ceramic package, packaging and characterization of a GaAs MMIC die in the metal ceramic package with optimised interconnections and validation of its performance parameters. The packaged MMIC was characterized under various environmental conditions like temperature cycling, burn-in test and life tests at as per MIL-STD 883 standard. The MMIC performance was monitored before and after every test condition. The packaged amplifier MMIC resulted in good input /output return losses (better than 17dB), linear gain of 20dB, gain flatness of less than 0.5dB, P1dB of 12dBm. It has shown very low drift in gain of plus/minus 0.22dB against 1dB and variation of 1percent in Ids against 10percent.
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