存储芯片封装中再分布轨迹与晶圆上互连的相互作用

Proceedings. 9th IEEE Workshop on Signal Propagation on Interconnects, 2005. Pub Date : 2005-05-10 DOI:10.1109/SPI.2005.1500936

M. Gospodinova, M.F. Ktata, J. Koellermeyer, G. Nan, M. Vogl, J. Thomas

{"title":"存储芯片封装中再分布轨迹与晶圆上互连的相互作用","authors":"M. Gospodinova, M.F. Ktata, J. Koellermeyer, G. Nan, M. Vogl, J. Thomas","doi":"10.1109/SPI.2005.1500936","DOIUrl":null,"url":null,"abstract":"In this paper, we investigate the interaction between redistribution traces and on-chip interconnects in memory chip packages. The electromagnetic interaction is shown both in the frequency and in the time domain. In addition the impact of this interaction on the performance of memory component(s) is explored.","PeriodicalId":182291,"journal":{"name":"Proceedings. 9th IEEE Workshop on Signal Propagation on Interconnects, 2005.","volume":"22 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2005-05-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Interaction of redistribution traces with on-wafer interconnects in memory chip packaging\",\"authors\":\"M. Gospodinova, M.F. Ktata, J. Koellermeyer, G. Nan, M. Vogl, J. Thomas\",\"doi\":\"10.1109/SPI.2005.1500936\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this paper, we investigate the interaction between redistribution traces and on-chip interconnects in memory chip packages. The electromagnetic interaction is shown both in the frequency and in the time domain. In addition the impact of this interaction on the performance of memory component(s) is explored.\",\"PeriodicalId\":182291,\"journal\":{\"name\":\"Proceedings. 9th IEEE Workshop on Signal Propagation on Interconnects, 2005.\",\"volume\":\"22 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2005-05-10\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings. 9th IEEE Workshop on Signal Propagation on Interconnects, 2005.\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/SPI.2005.1500936\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings. 9th IEEE Workshop on Signal Propagation on Interconnects, 2005.","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SPI.2005.1500936","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 0

摘要

在本文中，我们研究了内存芯片封装中重分配路径和片上互连之间的相互作用。电磁相互作用在频域和时域上均有表现。此外，还探讨了这种相互作用对存储组件性能的影响。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文本刊更多论文

Interaction of redistribution traces with on-wafer interconnects in memory chip packaging

In this paper, we investigate the interaction between redistribution traces and on-chip interconnects in memory chip packages. The electromagnetic interaction is shown both in the frequency and in the time domain. In addition the impact of this interaction on the performance of memory component(s) is explored.

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

Proceedings. 9th IEEE Workshop on Signal Propagation on Interconnects, 2005.

自引率

0.00%

发文量