基于LCP基板的共形相控阵收发模块研究

Yan Luo, Kai Liu, Qiujuan Gao, Lei Ding, Yi Zhou, Lichun Wang
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引用次数: 0

摘要

在共形相控阵雷达中,研究了基于LCP基板的柔性表面T/R模块,以解决器件与天线平面不匹配以及电缆连接插拔增加导致的系统不稳定等问题。对LCP层合质量控制和芯片嵌入进行了研究。利用ANSYS软件对LCP多层基板的装配应力进行了分析。结果表明,优化后的辅助材料层压工艺使衬底平整无腔。嵌入MMIC的LCP基板的气密性为7.4× 10-7 Pa。m3 / s。仿真结果表明,当LCP基板弯曲角度大于10度时,应力在-55 ~ 80℃范围内迅速增大。共形T/R模块在LCP基板弯曲10度时仍保持良好的性能。LCP衬底在共形相控阵中具有良好的应用前景。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Research on Conformal Phased Array T/ R Module Based on LCP Substrate
In the conformal phased array radar, the flexible surface T/R module based on LCP substrate was studied to solve the problems such as the mismatching between components and the antenna plane and the system instability caused by the increase of plug and unplug of cable connection. The LCP laminating quality control and the chip embedding was investigated. The assembly stress on LCP multi-layer substrate was analyzed with ANSYS. The results show that optimized lamination process with auxiliary material makes the substrate flat without cavity inside. The air tightness of LCP substrate embedded with MMIC is 7.4× 10–7 Pa . m3/s. The simulation results show that the stress increases rapidly between temperature of -55 and 80 degree centigrade when the LCP substrate's bending angle is greater than 10 degrees. The conformal T/R module remains well performance with LCP substrate bending 10 degrees. The LCP substrate has a good potential in conformal phased array.
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