{"title":"基于螺旋微带传输线的紧凑3d打印折叠分支混合式耦合器","authors":"Arnau Salas Barenys, N. Vidal, J. López-Villegas","doi":"10.1109/DCIS51330.2020.9268661","DOIUrl":null,"url":null,"abstract":"The aim of this work is to fabricate and characterize a very compact branch-line coupler at the UHF band, where the wavelength is critical for miniaturization. In order to do this, the advantages of a 3D-printed electronics manufacturing process developed in former work demonstrated the usability of helical-microstrip transmission lines and allowed the materialization of a new folded topology for hybrid couplers. The design methodology and the manufacturing process have been described. A conventional hybrid coupler has been also designed, manufactured and characterized in order to compare dimensions and model simulation and prototype characterization results in terms of the scattering parameters.","PeriodicalId":186963,"journal":{"name":"2020 XXXV Conference on Design of Circuits and Integrated Systems (DCIS)","volume":"32 3 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2020-11-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Compact 3D-Printed Folded Branch-Line Hybrid Coupler based on Helical-Microstrip Transmission Lines\",\"authors\":\"Arnau Salas Barenys, N. Vidal, J. López-Villegas\",\"doi\":\"10.1109/DCIS51330.2020.9268661\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The aim of this work is to fabricate and characterize a very compact branch-line coupler at the UHF band, where the wavelength is critical for miniaturization. In order to do this, the advantages of a 3D-printed electronics manufacturing process developed in former work demonstrated the usability of helical-microstrip transmission lines and allowed the materialization of a new folded topology for hybrid couplers. The design methodology and the manufacturing process have been described. A conventional hybrid coupler has been also designed, manufactured and characterized in order to compare dimensions and model simulation and prototype characterization results in terms of the scattering parameters.\",\"PeriodicalId\":186963,\"journal\":{\"name\":\"2020 XXXV Conference on Design of Circuits and Integrated Systems (DCIS)\",\"volume\":\"32 3 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2020-11-18\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2020 XXXV Conference on Design of Circuits and Integrated Systems (DCIS)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/DCIS51330.2020.9268661\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2020 XXXV Conference on Design of Circuits and Integrated Systems (DCIS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/DCIS51330.2020.9268661","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Compact 3D-Printed Folded Branch-Line Hybrid Coupler based on Helical-Microstrip Transmission Lines
The aim of this work is to fabricate and characterize a very compact branch-line coupler at the UHF band, where the wavelength is critical for miniaturization. In order to do this, the advantages of a 3D-printed electronics manufacturing process developed in former work demonstrated the usability of helical-microstrip transmission lines and allowed the materialization of a new folded topology for hybrid couplers. The design methodology and the manufacturing process have been described. A conventional hybrid coupler has been also designed, manufactured and characterized in order to compare dimensions and model simulation and prototype characterization results in terms of the scattering parameters.
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