产品相关包装结构的时域和频域传输线参数的确定

2007 IEEE Workshop on Signal Propagation on Interconnects Pub Date : 2007-05-13 DOI:10.1109/SPI.2007.4512221

T. Winkel, A. Deutsch, G. Katopis, G. Kopcsay, W. Dyckman, B. Chamberlin, C. Surovic, H. Liu, C. Baks

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引用次数: 0

摘要

已建成一级和低损耗二级封装专用试验车辆，包括与产品相关的测试线结构。在较宽的频率范围内对传输线特性参数进行了时域和频域测量。通过对所得结果的比较，讨论了不同方法的优点和局限性。

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Determination of transmission line parameters in time- and frequency domain for product related packaging structures

Special test vehicles have been built for first and low loss second level packages including product related test line structures. The characteristic transmission line parameters were measured in the time and in the frequency domain in a wide frequency range. Advantages and limitations of the different methods are discussed by comparing the obtained results.

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2007 IEEE Workshop on Signal Propagation on Interconnects

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