层合薄板扩散键合制备94GHz开槽波导阵列天线

J. Hirokawa, Miao Zhang, M. Ando
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引用次数: 17

摘要

采用层压薄板扩散键合的方法制备了94GHz频段的单层开槽波导阵列天线。由于刻蚀精度高,成本低,是一种很有前途的低成本制造技术。即使在94GHz这样的高频下,通过扩散键合,也可以实现槽片与槽波导底座之间完美的电连接。设计了一种以铜为材料的18×18-element天线。该铜天线在93.7GHz下获得31.4dBi增益,天线效率达到60%。采用铜扩散键合的工艺会导致槽的过蚀刻50um,导致孔径效率降低0.8dB。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
94GHz fabrication of a slotted waveguide array antenna by diffusion bonding of laminated thin plates
We fabricate the single-layer slotted waveguide array antenna in 94GHz band by diffusion bonding of laminated thin metal plates. This new fabrication technique is a promising one of low cost, because of the high-precision etching in low price. Perfect electric connection can be realized between the slotted plate and the grooved waveguide base by diffusion bonding even at a high frequency such as 94GHz. A designed 18×18-element antenna is trial fabricated by using copper. The antenna efficiency is achieved at 60% for 31.4dBi gain at 93.7GHz in this copper antenna. The process of diffusion bonding using copper could result in over-etching of the slots by 50um, which degrades the aperture efficiency by 0.8dB.
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