抑制半无桥PFC变换器辐射EMI噪声的封装设计考虑

2023 35th International Symposium on Power Semiconductor Devices and ICs (ISPSD) Pub Date : 2023-05-28 DOI:10.1109/ISPSD57135.2023.10147635

Satoshi Yoshida, T. Yasuzumi, Tsuguhiro Tanaka, Yasuyuki Fujiwara

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引用次数: 1

摘要

半无桥功率因数校正(PFC)转换器在效率、传导电磁干扰(EMI)性能和成本之间提供了极好的权衡。然而，减少辐射电磁干扰仍然是一个问题。提出了一种实现低辐射电磁干扰半桥式PFC变换器的多芯片封装设计。将所提出的封装设计应用于1.0 kW半无桥PFC变换器，并成功地证明了辐射EMI的降低。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Package Design Consideration for Suppressing Radiated EMI Noise in Semi-Bridgeless PFC Converters

A semi-bridgeless power factor correction (PFC) converter offers an excellent trade-off between efficiency, conducted electro-magnetic interference (EMI) performance, and cost. However, reduction of radiated EMI remains as an issue. This paper proposes a multichip package design for realizing low radiated EMI semi-bridgeless PFC converters. The proposed package design was applied to a 1.0 kW semi-bridgeless PFC converter and reduction of the radiated EMI was successfully demonstrated.

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2023 35th International Symposium on Power Semiconductor Devices and ICs (ISPSD)

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